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Characteristics
Use copper foil as carrier, coated with graphene and heat resistant adhesive, excellent heat conducting.
Ultra-thin design for electronic components and parts.
EMI shielding, good resistance to heat, ageing and humidity.
Structure
Adhesive Type | Tape Thickness (mm) | Release Liner Thickness (mm) | Width |
Acrylic PSA | 0.040 | 0.050 | MAX 580mm |
Application
Thermal management solution for electronic components and parts.
EMI shielding for electronic products
Properties
Test Items | Value | Test Methods | |
Adhesion (gf/25mm) | 700 | JISZ0237 8 | |
Cohesion (mm) | 0.2 | JISZ0237 11 | |
Tack (J.DOW) | 32 | JISZ0237 12 | |
Thermal Conductivity (W/m.K) | Horizontal | 330 | Corporation Standard |
Vertical | 32 | ||
Radiance | 0.97 | - | |
Surface Resistivity (Ω/□) | 107-109 Tester | Tester | |
Storage Life
6 months after received. When in storage, avoid direct sunlight, high temperature (over 40°C) and high humidity (over 70% RH).
Customize Product
Custom Solutions
Phone
86-185-5927-7928E-mail
info@sumigawa.comWhatsApp
Inquiry
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